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Wettability of PCB Surface Finishes and Comparison of Methods
Vídeňský, Ondřej ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This bachelor´s thesis deals with testing methods for surface finishe´s wettability PCB. For this tests has been designed and created testing board which contains testing coupons for testing methods. Boards have been created and covered by surface finishes by Gatema Boskovice. In this thesis electroless nickel with immersion gold (ENIG) and immersion tin have been tested. For simulation of reflow soldering have been used test methods solder indicator, solder spread test and dewetting test. Wetting balance test method has been used as simulation of wave soldering.
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Quality of PCB Surface Finishes and Test Coupon Optimization
Minář, Jan ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface finishes, using a test coupon developed in cooperation with firm Gatema. It deals with surface finishes ENIG and immersion tin. For these samples deals with quality monitoring and periodic testing of these surface finishes. The solder using for tests is SAC305. Test methods are used for simulation of reflow soldering and wave soldering.
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Solder Joint Reliability and Wetting Characteristics Influence
Labaj, Radek ; Stejskal, Petr (referee) ; Starý, Jiří (advisor)
This thesis deals with the methodology of testing the wetting characteristics for different material and process effects in the double-plated base material. Testing is performed by wetting balance method. There is designed procedure to calculate the angles on each side of the non-homogeneous material. The Design of Experiments method is used to interpret the results, by using this method are also interpreted electrical and mechanical properties of solder joints. The correlation with wetting characteristics is discussed.
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Solder Joint Conductivity - Influence of Solder Volume and Isothermal Aging
Mach, Ladislav ; Schnederle, Petr (referee) ; Starý, Jiří (advisor)
The master thesis analyses electrical conductivity of lead-free solder joints. The test method design for monitoring the electrical conductivity of the soldered joint is described in the practical part. Simulated BGA package with four pin (BGA4) is used for experiments. Tested PCBs are subjected to isothermal aging and current load. During isothermal aging is measured electrical conductivity and optical microscope is used for intermetallic layer (IMC) growth observation. Two types of surface finish (OSP and ENIG) are used for tests and three diameters of solder terminal balls (solder alloy SAC405). The influence of the ratio area connection / solder volume (ratio S / V) on lead-free solder joints conductivity was evaluated.
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Wave Soldering Fluxes and Flux Residues
Kryll, Josef ; Dušek, Karel (referee) ; Starý, Jiří (advisor)
This work deals with issues of flux residues after wave Soldering. The general aim is to create methodology for measuring the surface insulation resistance values of flux residues after soldering and isothermal heating. Finding the ammount of ionic contamination by using conductometric method. Measurement of wettability of Cu wire by using wetting balance method for different fluxes. The aim is then to compare the measured values with the values dictated by the manufacturer.
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WETTABILITY OF PCB SURFACE FINISHES
Minář, Jan ; Jana, Toulová (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis with measuring of wetting characteristics by the wetting balance method for samples of different surface finishes from the firm Gatema. It deals with influence of the isothermal aging and reflow processes on wetting characteristics of surface finishes ENIG, HAL and immersion tin. The influence of intermetallic layer on the overall wettability is studied in case of the surface finish of immersion tin. Also deals with the wettability of the nickel layer, after stripped off gold, in case of the surface finish of ENIG.
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Quality of PCB Surface Finishes and Test Coupon Optimization
Minář, Jan ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface finishes, using a test coupon developed in cooperation with firm Gatema. It deals with surface finishes ENIG and immersion tin. For these samples deals with quality monitoring and periodic testing of these surface finishes. The solder using for tests is SAC305. Test methods are used for simulation of reflow soldering and wave soldering.
|
|
|
Wettability of PCB Surface Finishes and Comparison of Methods
Vídeňský, Ondřej ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This bachelor´s thesis deals with testing methods for surface finishe´s wettability PCB. For this tests has been designed and created testing board which contains testing coupons for testing methods. Boards have been created and covered by surface finishes by Gatema Boskovice. In this thesis electroless nickel with immersion gold (ENIG) and immersion tin have been tested. For simulation of reflow soldering have been used test methods solder indicator, solder spread test and dewetting test. Wetting balance test method has been used as simulation of wave soldering.
|
|
|
WETTABILITY OF PCB SURFACE FINISHES
Minář, Jan ; Jana, Toulová (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis with measuring of wetting characteristics by the wetting balance method for samples of different surface finishes from the firm Gatema. It deals with influence of the isothermal aging and reflow processes on wetting characteristics of surface finishes ENIG, HAL and immersion tin. The influence of intermetallic layer on the overall wettability is studied in case of the surface finish of immersion tin. Also deals with the wettability of the nickel layer, after stripped off gold, in case of the surface finish of ENIG.
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|
|
Wave Soldering Fluxes and Flux Residues
Kryll, Josef ; Dušek, Karel (referee) ; Starý, Jiří (advisor)
This work deals with issues of flux residues after wave Soldering. The general aim is to create methodology for measuring the surface insulation resistance values of flux residues after soldering and isothermal heating. Finding the ammount of ionic contamination by using conductometric method. Measurement of wettability of Cu wire by using wetting balance method for different fluxes. The aim is then to compare the measured values with the values dictated by the manufacturer.
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